Discovering Delta’s Cloud to Edge AI

2025 OCP Global Summit
October 15 – 17
Booth # B51 │ San Jose Convention Center
Join Our Sessions
Topic: Data Center In-Row Cooling Integrated Solutions
Speaker: Chris Su, Line of Business Head Cloud/Data Center Segment, Delta Electronics
Time: October 14, 1:39pm - 1:54pm
Venue: SJCC - Concourse Level - Expo Hall Theater
Topic: Delta HVDC Power and Cooling Solutions for Data Centers
Speaker: Ralf Pieper, Research and Design Director, Delta Electronics
Chih-Chung Chen, Sales Product Manager, Delta Electronics
Harry Petty, Senior Technical Manager, NVIDIA
Time: October 14, 2:45pm - 3:10pm
Venue: SJCC - Concourse Level – 211

Visit us at Booth # B51

800 VDC Solution
Power and Cooling Solutions for AI Computing
+/- 400 VDC Solution
Greening Intelligence
Visit us at Booth # B51

800 VDC Solution

Delta’s 800 VDC solution powers AI and high-performance data centers with megawatt-scale efficiency. Featuring advanced racks, shelves, and HVDC distribution boards, it delivers up to 98.5% efficiency and reliable performance for dense, GPU-intensive workloads.

Power and Cooling Solutions for AI Computing

AI workloads demand massive computing power and generate significant heat. Delta’s integrated power and cooling solutions, from rack to chip level, ensure stable operation, energy efficiency, and scalable performance with high-density power systems and advanced liquid and air-assisted cooling.

+/- 400 VDC Solution

Delta’s ±400 VDC solution delivers up to 2.4 MW at 98% efficiency, supporting scalable AI data centers with In-Row Power, high-efficiency ORV3 shelves, and a compact UL9540A-certified 72 kW battery backup system for reliable, cost-effective performance.

Greening Intelligence

Charting the future of sustainable AI is a report from Economist Impact, supported by Delta Electronics, that examines the challenges and opportunities that organisations worldwide face with AI and sustainability.
 

  • Global focus on AI sustainability will rise from 44% to 78% in 12 month.
  • 38% of AI suppliers identify power and grid resilience as the top sustainability challenge.
  • 42% of AI suppliers adopt edge computing to improve energy efficiency.
Read Report

 


Learn more about Delta’s Air-Assisted Cooling Solution
Product Highlights

In-Row Power

 

  • 1.1 MW in-row power
  • 98% efficiency
  • Works with new & existing racks
  • Rapid AI data center scaling
  • No full electrical overhaul needed

 

Advanced Power Utilization and Regulation Appliance (APURA)

 

  • Limits peak-to-average AC current
  • Smooths GPU peak loads
  • Eliminates overshoots/undershoots
  • Up to 97% efficiency

 

1.6T Data Center Switch

 

  • 64×1.6T switch (Broadcom Tomahawk6)
  • 224G-per-lane, ultra-low latency
  • 1.6T per port
  • Air & liquid cooling
  • Optimized for AI/GPU scale-out

 

300kW L2A CDU

 

  • For HPC and AI workloads
  • No raised floors or complex piping
  • Direct-to-chip integration
  • Flexible, scalable for future expansion

 

19-inch 90kW HVDC DC-DC Power Shelf

 

  • Capable of converting 800VDC to 50VDC
  • Up to 98% power conversion efficiency
  • Up to 130W/Inch3 power density
  • Up to 180% GPU load EDPP
  • Both input and output reverse current protection

 

21-inch 108 kW HVDC DC-DC Power Shelf

 

  • Capable of converting 800VDC to 50VDC
  • Up to 98% power conversion efficiency
  • Up to 95W/Inch3 power density
  • Up to 180% GPU load EDPP
  • Both input and output reverse current protection

 

12kW 800V HVDC Power Distribution Board

 

  • Capable of converting 800VDC to 50/12VDC
  • Up to 1,000W/inch3
  • 98.5% peak efficiency
  • Built-in hot-swap capability

 

L2L In-Row CDU - 2MW

 

  • Pump and Driver full Redundant design
  • Minimized pressure impedance
  • Flexible deployability for in-row and off-row
  • Coolant connection through the top
  • Hot-swapable filter included
  • Multiple protocol: Redfish/Webpage/Modbus
  • Alert Push: SNMP Trap/E-Mail
  • Emergency Mode
  • Proactive Alarm Mechanism
  • HMI screen with touch functionality

 

4U L2L In-Rack CDU - 140kW

 

  • Cooling capacity: 140kW
  • Flow rate: 150LPM @20 psi
  • Higher pumping power with low approach temp
  • Pump Redundant 2+1
  • HMI screen with touch functionality
  • Leakage, dew point, coolant level protections
  • Dimension: 17.5(W) × 31.7(D) × 6.9(H) in.

 

20U L2A In-Rack CDU - 25kW

 

  • Cooling capacity: 25kW
  • Flow rate: 32LPM @20 psi
  • Pump & PSU redundant design
  • Hot swap FAN design
  • Leakage, coolant level protections
  • Dimension: 17.7(W) × 34.7(D) × 35.0(H) in.

 

Cold Plate Loop for GPUs

 

  • Cooling capacity: 6200kW (6*AI GPU + 2*CPU)
  • Microchannel cold plate design
  • Impingement cooling design
  • Precision liquid flow distribution design
  • Hot swappable / Dry disconnect capability
  • Flexible copper tube design
  • Dimension: 21.5(L) × 7.5(W) × 1.1(H) in.

 

 

Liquid Cooled Busbar

 

  • Current Rating: 4000A@2LPM per power zone
  • Application Voltage : 40Vdc~60Vdc
  • Optimized Fin Channel and Flow Rate for Excellent Heat-Exchange
  • MGX and ORV3 Compatible

 

e-Fuse Module

 

  • SiC based switch
  • Low turn ON resistance in mΩ
  • Cut-off time <3us
  • Smaller size: 68 x 42 x 18mm3

 

Power Choke

 

  • High power density (Dual / Quad choke)
  • High current, high operating temp. (150°C)
  • Compliant with immersion liquid cooling test conditions
  • Ultra thin package for VPD and SiP module application

 

Solid-State Transformer (SST)

 

  • Bridges MV & LV grids in one integrated system
  • AC/DC conversion with smart multi-output management
  • Reduces footprint and energy loss
  • Scalable, resilient power for space-constrained environments

 

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