800 VDC 25kW Electrical Pump
Designed for 800 VDC AI data centers, this compact, lightweight pump delivers up to 1,280LPM flow rate and 60psi pressure for efficient, stable cooling at operating point.
450mm EC Blower
Delta’s next-generation HVDC Rack Fan supports ±400 VDC and 800 VDC, delivering high-efficiency, reliable cooling with optimized airflow and reduced power conversion losses for AI data centers.
OCP Project Deschutes 5 In-Row CDU
Deschutes 5 is a hyperscale liquid cooling solution delivering 2 MW of cooling at a 3°C approach temperature, built for next-generation AI and high-density IT loads. Combining Google’s data center expertise with Delta’s advanced thermal management and manufacturing capabilities, it delivers industry-leading heat dissipation, high-flow capacity, superior pressure management, and optimized electrical and spatial efficiency.
Modular Stack up L2L CDU
Multiple In-Rack CDU modules are stacked and integrated into an In-Row architecture, enabling scalable cooling performance and centralized management—delivering efficient and stable liquid cooling for high-density computing environments.
In-Rack 4U 200kW L2L CDU
The CDU provides 200kW cooling capacity for the latest liquid cooled AI Rack, design with 1+1 redundant pumps and coolant leakage protection, ensure 24/7 operation.
VR200 Cold Plate
Featuring microchannel and multi-impinging flow design, it enhances heat transfer and reduces flow resistance. With passive flow control and advanced metal bonding processes, it delivers over 10,460W cooling capacity with robust reliability.
Powershelf Embedded Cold plate
Supports customized overall dimensions and an ultra-thin design. Manifold design for flexible space and layout requirements. The multi-channel design effectively reduces flow resistance and enables optimized flow path layouts for localized hotspots.
Switch Networking Cold plate
Support 102.4T switch liquid cooling, integrating ASIC, DIMM, 1.6T OSFP, and power-board cooling. Optimized cold plate and manifold design provides high heat-removal capability, balanced flow distribution, and scalable thermal performance for next-generation high-power networking systems.
SSD Cold plate
A modular SSD cold plate solution that brings liquid cooling to dense storage systems, combining compact thermal design with shared coolant distribution to support flexible integration across multiple drives.
Double-Sided Cooling Solution for OAC
VPD Double-Sided Cooling Solution for OAC (Open Adapter Card), supporting 3,000 W computing and 500 W power cooling in a slim 40 mm cold plate profile, with heat flux exceeding 170 W/cm².
IHS
Integrated Heat-Spreader (IHS) technology combines CTE-compatible design with advanced ceramic composite materials to enhance thermal and structural performance. Direct, zero-gap contact with the chip enables rapid heat spreading and efficient heat transfer.
MCL
Microchannel Lid (MCL) features 80–300 μm coolant channels and close chip integration to manage high heat flux. Its thin profile supports compact designs and efficient use of space.